High-Tg FR-4
Circuit boards on high glass-transition FR-4 for designs exposed to heat.
High-Tg FR-4 with ShinePCB
High-Tg laminates keep their mechanical stability at higher temperatures, which helps during lead-free assembly and in hot operating environments. We choose the laminate with your stack-up and confirm it for each project.
- Operating and assembly temperatures
- Laminate selection
- Compatibility with lead-free assembly
- Thickness and stack-up
Capability and certificates
| Positioning | Industrial / Automotive | |
|---|---|---|
| Standard / prototype | Advanced / mass production | |
| High-Tg FR-4 | TG150/TG170; ITEQ IT-180A, Isola 370HR, Panasonic HIPER V | Available on Request |
Related certificates
- IECQ QC 080000IECQ-H NQAGB 25.0038
- IATF 16949:2016NQA T14016 / IATF 0498905
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
High-Tg and FR-4 laminates
| Material | Series | Tg | Dk | Df | Typical use |
|---|---|---|---|---|---|
| ITEQ IT-180A | High-Tg FR-4 | — | — | — | Automotive, industrial control, high reliability |
| Panasonic HIPER V R-1755V | High-Tg low-CTE epoxy | 173 °C | 4.44 @ 1 GHz | 0.016 | High-reliability multilayer; lead-free assembly |
| Shengyi S1000-2 | Lead-free FR-4 | — | — | — | Rigid PCB; high layer count |
| Shengyi S1000 | FR-4 | — | — | — | Standard multilayer |
| Shengyi S1155 | FR-4 | — | — | — | Lead-free, halogen-free multilayer |
| ITEQ IT-158 | FR-4 | — | — | — | Lead-free multilayer |
| TUC TU-862HF | Halogen-free FR-4 | — | — | — | Halogen-free multilayer |
| Panasonic R-1566W | Lead-free FR-4 | — | — | — | Standard and high-reliability multilayer |
| Elite Material (EMC) EM827 / EM825 / EM285 | Lead-free / halogen-free CCL | — | — | — | Standard and high-reliability multilayer |
Source: ShinePCB capability workbook, material sheet. Dk, Df and Tg are typical supplier datasheet values (test frequency shown where the source lists it). They describe the laminate, not the finished board. Grades are available on request and confirmed with availability during engineering review. "—" means no value is listed in the source.
Typical applications
Industrial electronics
Automotive modules
Power and lighting products
From prototype to production
Every order follows the same controlled sequence. Prototype and production requirements are reviewed separately.
File review
Gerber or ODB++, drill data, drawing and quantities are checked for completeness.
Engineering questions
Open points on manufacturability, materials or special processes are sent before quotation.
Stack-up and material
Construction, laminate and finish are confirmed with you and written into the order.
Fabrication
The order is released to the facility whose process and qualification fit the requirements.
Inspection and test
Inspection and electrical test follow the methods agreed for your order.
Packing and delivery
Boards are packed and shipped under the confirmed delivery terms.
What to send for a PCB review
Start with the details you have — engineering will request anything else needed for the review.
Files and details for a PCB review
- Gerber (RS-274X) or ODB++ data with drill files
- Fabrication drawing with material, thickness and finish
- Stack-up and impedance targets, if any
- Quantity for prototype and for production
- Special requirements such as IPC class, testing or packaging
Technical files stay private
Customer Gerber, BOM and design data are managed under an ISO/IEC 27001 information security system and shared only within your project.
High-Tg FR-4 FAQs
When should I use high-Tg FR-4?
When your board faces high operating temperatures, multiple reflow cycles or thick constructions. Engineering can advise.
Does high-Tg change the stack-up?
The material is confirmed together with the stack-up during review.
